Tungsten copper carrier

Tungsten copper material:

☆ A composite material of tungsten and copper, which has both the low expansion characteristics of tungsten and the high thermal conductivity of copper, and its thermal expansion coefficient and thermal conductivity and conductivity can be designed by adjusting the composition of the material. Tungsten copper materials can form a good thermal expansion match with ceramic materials, semiconductor materials, metal materials, etc., mainly used in radio frequency, microwave, semiconductor high-power packaging, optical communication and other industries.

Product Application:

☆ RF microwave, millimeter wave, terahertz, laser, optical communication and other high-power devices;

☆ High performance lead frame;

☆ Thermal control board and radiator of military and civilian thermal control devices, etc.

Product Features:

☆ Without Fe, Co and other sintered activated elements, high thermal conductivity can be maintained;

☆ Excellent gold plating welding performance, air tightness;

☆ Small density, more suitable for aerospace avionics;

☆ With roughness≤ 25nm mirror polishing finished nickel plating gold plating ability;

☆ Provide semi-finished products or surface plating Ni, Ni/Au, partial Ni/Au and other finished products;

☆ Pre-sale/sale/after-sales technical services.