Molybdenum Copper Carrier
Molybdenum copper alloy
Molybdenum copper is a composite material (pseudoalloy) composed of molybdenum and copper two metals, its physical and mechanical properties are similar to tungsten copper, the same has an adjustable thermal expansion coefficient and thermal conductivity, and non-magnetic, low gas content, good vacuum performance and other characteristics, because the density of molybdenum copper is much smaller than tungsten copper, so it is more suitable for aerospace and other fields.
Product application
☆ RF microwave, millimeter wave, terahertz, laser, optical communication and other high-power devices
☆ High performance lead frame
☆ Thermal control board and radiator of military and civilian thermal control devices, etc
Product Features:
☆ Without Fe, Co and other sintered activated elements, high thermal conductivity can be maintained
☆ Excellent gold-plated welding performance, air tightness
☆ Small density, more suitable for aerospace avionics
☆ Provide semi-finished products or surface plating Ni, Ni/Au, partial Ni/Au and other finished products
☆ Pre-sale/sale/after-sales technical services
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Molybdenum copper composite |
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Ingredients |
Performance |
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Material composition |
Chemical composition (% by weight) |
Density |
Thermal conductivity |
Coefficient of thermal expansion |
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Mass density |
Relative density |
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(wt%) |
Mo |
Cu |
g/cm3 |
%T.D. |
(W/m·K) |
(×10-6/K) |
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Mo90Cu10 |
90±1.0 |
Balance |
10.0 |
≥99 |
150~160 |
5.6 |
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Mo85Cu15 |
85±1.0 |
Balance |
9.95 |
≥99 |
160~180 |
6.8 |
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Mo80Cu20 |
80±1.0 |
Balance |
9.9 |
≥99 |
170~190 |
7.7 |
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Mo70Cu30 |
70±1.0 |
Balance |
9.8 |
≥99 |
180~200 |
9.1 |
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Mo60Cu40 |
60±1.0 |
Balance |
9.6 |
≥99 |
210~250 |
10.3 |
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Mo50Cu50 |
50±1.0 |
Balance |
9.5 |
≥99 |
230~270 |
11.5 |
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Mo40Cu60 |
40±1.0 |
Balance |
9.4 |
≥99 |
280~290 |
11.8 |
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