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Molybdenum Copper Carrier

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IMG00009-2
IMG00011-2
Product details

Molybdenum copper alloy

   Molybdenum copper is a composite material (pseudoalloy) composed of molybdenum and copper two metals, its physical and mechanical properties are similar to tungsten copper, the same has an adjustable thermal expansion coefficient and thermal conductivity, and non-magnetic, low gas content, good vacuum performance and other characteristics, because the density of molybdenum copper is much smaller than tungsten copper, so it is more suitable for aerospace and other fields.
Product application
☆ RF microwave, millimeter wave, terahertz, laser, optical communication and other high-power devices
☆ High performance lead frame
☆ Thermal control board and radiator of military and civilian thermal control devices, etc
Product Features:
☆ Without Fe, Co and other sintered activated elements, high thermal conductivity can be maintained
☆ Excellent gold-plated welding performance, air tightness
☆ Small density, more suitable for aerospace avionics
☆ Provide semi-finished products or surface plating Ni, Ni/Au, partial Ni/Au and other finished products
☆ Pre-sale/sale/after-sales technical services

 

Molybdenum copper composite

Ingredients

Performance

Material composition

Chemical composition (% by weight)

Density

Thermal conductivity

Coefficient of thermal expansion

Mass density

Relative density

(wt%)

Mo

Cu

g/cm3

%T.D.

(W/m·K)

10-6/K)

Mo90Cu10

90±1.0

Balance

10.0

≥99

150~160

5.6

Mo85Cu15

85±1.0

Balance

9.95

≥99

160~180

6.8

Mo80Cu20

80±1.0

Balance

9.9

≥99

170~190

7.7

Mo70Cu30

70±1.0

Balance

9.8

≥99

180~200

9.1

Mo60Cu40

60±1.0

Balance

9.6

≥99

210~250

10.3

Mo50Cu50

50±1.0

Balance

9.5

≥99

230~270

11.5

Mo40Cu60

40±1.0

Balance

9.4

≥99

280~290

11.8

关键词:
Molybdenum Copper Carrier
MoCu Carrier
Tungsten Copper Carrier
Tungsten Copper Substrate
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