Thin film hybrid integrated circuit

     Thin film hybrid integrated circuit (HIC) is an aspect of microelectronic technology, which is mainly an electronic system composed of micro electronic components. It mainly depends on the specific process to form a passive network on (or within) a separate substrate and interconnect active devices, so as to form a micro electronic circuit. Thin film circuit has the advantages of wide component parameter range, high precision, good stability, good temperature and frequency characteristics, high integration and small size, but the process equipment is expensive and the production cost is high. It complements and permeates with semiconductor integrated circuits. It has become an important part of integrated circuits. It is widely used in many fields such as low-frequency microwave circuits and plays an important role in promoting the miniaturization of electronic equipment.

    Compared with thick film hybrid integrated circuit, thin film hybrid integrated circuit is characterized by wide parameter range, high precision, good temperature and frequency characteristics, and can work to millimeter microwave band. It has high integration and small size. However, the process equipment used is relatively expensive and the production cost is relatively high.

    Thin film hybrid integrated circuits are suitable for all kinds of circuits, especially analog circuits requiring high precision and good stability. Compared with other integrated circuits, it is more suitable for microwave circuits.